Enables high speed, flexible combination, and cleaner fluid channels. Eliminates adhesive residue within fluid channels.

Enables devices to scale to high volumes and allows for reproducible product performance while eliminating technique dependency.

Delivers fine line, micron-level feature sizes and enables non-contact, tool-less production.

Allows for lamination of ultra thin, fine materials and creation of multilayered subassemblies in web format. Enables reduction of touch points on product.

Enables necessary biochemistry to occur inside targeted areas on device.

Enables direct integration of electrodes into devices. Creates pockets for vents and reagent reservoirs.

Enables integration of blister packs, piercing structures, and deep reagent reservoirs.

Enables electrical and fluidic interconnections between substrates. Enables breathability of certain areas for controlled out-gassing. Enables fluidic inlet and outlet ports to another device.

Enables desired surface energy characteristics. Enables integration of on-device electrodes.

Enables low cost method of delivering non-Critical to Quality (CtQ) features.